Tremendous Growth Opportunities in the PV Materials Market, according to New Report

Tremendous Growth Opportunities in the PV Materials Market, according to New Report

SEMI and Linx-AEI Consulting announce a new report that delivers detailed insights about growth opportunities in the soaring photovoltaic (PV) materials market.  Driven by the global demand for economically viable, renewable solar power— expected to more than triple from 2010 to 2015— materials for crystalline silicon and thin-film modules are one of the largest and fastest growing markets for suppliers of electronic materials. The new report includes detailed insights into the demand for silicon, slurries, gases, wet chemicals, precursors, dopants, and other critical materials. 

The market for advanced chemicals and materials used in PV solar cells and modules grew by 89 percent in 2010 to $8.6 billion.  The market is projected to grow to a forecasted $22.4 billion in 2015. The outlook for materials sales in 2011 will slow slightly as PV module demand in Germany adjusts to new incentive policies and module prices decline.  Growth resumes in 2012 as new markets emerge, according to the industry report. The growth trend in the aggregate global market for the materials covered is shown below.

The Chemicals & Materials for Photovoltaic Cells and Modules report analyzes the production processes and supply chain trends for the manufacture of cells and materials, as well as examining the emerging materials requirements for novel technologies.  The growth trend in the aggregate global market for the materials covered is shown in the following graphic.

 PV Cell and Module Chemical and Material Demand

PV Cell and Module Chemical and Material Demand

The report outlines key PV technology developments in major market segments and discusses their implications for materials supply and innovation. In crystalline silicon, a drive to increasing material and cell efficiency is opening the door to:

  • Diamond Wire Sawing.  Diamond wire sawing is gaining acceptance at the expense of the traditional alternative – multi wire slurry sawing (MWSS).  This being driven primarily by productivity enhancements.  Diamond wire sawing can achieve two to three times the productivity of MWSS.  However, there is a significant difference in the cost of consumables, where steel wires can cost roughly $2 per kilometer and diamond wires can be $200.  However, this is typically offset on a cost of ownership basis due to lack of slurry requirement, yield and productivity enhancements.
  • Improved Texturization Processes.  An example is a novel texturization process from 1366 Technologies. They are promoting a process for honeycomb light-trapping surface texture that reportedly adds 0.3-0.5 percent absolute efficiency improvement over current mc-Si iso texturing, at little additional cost.  (Other cell makers already use honeycomb-like surface textures to trap more light, but making the controlled 3D shapes typically involves more costly SiN vacuum deposition, or laser ablation before etch.)  This is accomplished using the 1366-Patterning machine.  The process involves coating the wafer with a very low-cost resist, which is then patterned with an imprint process, then etched with their tool partner RENA’s inline wet processing tools using various etch chemistries.
  • Novel Selective Emitter Schemes.  The Innovalight Cougar platform is the first commercial nanoparticle ink designed for selective emitter formation.  Innovalight claims  that they will increase their efficiency improvements to 2 percent in 2011, and 3 percent  in 2012.  The technology uses a silicon ink that is screen printed and dried, with throughputs as high as 1,500 wph.  The Si ink is printed to a 40 mm larger line than the subsequent metal line, and is fired to both densify the ink into solid silicon, and drive the dopant in the ink into the wafer surface.  Conductivities of 50 ohm sq under the line can be achieved, whereas unprinted areas remain at 80 to 100 ohm sq.  In addition, the fired ink leaves visible pattern that allows subsequent alignment.  Tests have shown final results of 18.9 percent on mono wafers, and Yingli claims 0.5 percent improvement on multi with best cells at 17.2 percent.
  • Ion Implant.  Varian has developed a high throughput ion implanter for use in the solar industry.  The tool is claimed to have a throughput of 1,000 wafers per hour, and implants wafers twice. The first is a background n-type implant to form the field emitter and the second is a metal shadow-masked implant for emitter.  The second implant is followed by an anneal to activate the implant.  Ion implant creates a high-quality junction with low damage, high uniformity, and excellent edge acuity.  Efficiencies of 18.8 to 19 percent have been demonstrated on mono wafers. It is thought that this will enable a path to IBC cells on n-type wafers and Varian claims a one year payback period on an implanter.
  • Novel Plating Technologies.  After inkjet or laser patterning of the front side ARC, a thin layer of electroless nickel is deposited to form nickel silicide contact.  This is compatible with thin, high-resistance homogeneous emitters, as well as heavier doped selective emitters.  The Ni thicknesses can be as low as 50 nm and the nickel silicide provides maximum adhesion and an intimate contact for an electron pathway to subsequently deposited conductors such as Cu and Sn. 
  • New Passivation Layer Technologies.  Most current technology uses Aluminum paste fired to form a rear-side eutectic layer as a passivation layer, and Back Surface Field.  Replacement of this with PECVD nitride is impractical due to intrinsic charge if the nitride and the formation of shunts at contact points.  However, a thin layer of Al2O3 has been shown to significantly improve the rear surface recombination characteristics, and would be compatible with proposed rear side point contact technology.

Innovative processes such as these form an important route for the improvement of Silicon cell efficiency.  Much of the industry innovation is generated within the supply base.  As we see below, the leading filers for IP include equipment manufacturers and chemicals and materials suppliers:

As the industry implements these new technologies, it is opening the door for greater participation from chemicals and materials suppliers and OEMS to drive more innovative solutions. 

For more information about this report, please contact Melody Song (SEMI) at msong@semi.org or 408.943.7949 or Mike Corbett (Linx) at mcorbett@linx-consulting.com or 973.437.4517. 

To purchase this report, visit http://www.semi.org/en/Store/MarketInformation/PVChemicalsAndMaterials.

 

SEMI
www.semi.org
March 1, 2011